SR / 002Product catalog

From module to system, one open architecture.

Pick the silicon, reuse the carrier, deploy the system. Every platform is documented in the open and built to stay in production for years.

Silicon

Arm or x86, seven vendors, chosen per workload.

System-on-Module

Pin-compatible modules carry the SoC, memory, and power.

Carrier / SBC

Reusable carriers and open dev boards expose the I/O.

System

Sealed fanless computers, gateways, and Arm servers.

Six platform families

Bedrock family

Fanless Industrial PCs

Sealed, passively cooled edge-AI computers built to run where fans cannot.

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i.MX · RZ · Hailo · Ryzen

Systems-on-Module

Pin-compatible modules that let you swap silicon, not the product.

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Layerscape · OCTEON · SolidWAN

Networking Platforms

Arm networking from 2 to 16 cores, wired straight to the CPU.

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SolidSense · HummingBoard IIOT

Edge Gateways

Deployment-ready IoT gateways with mesh, cellular, and vision options.

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HoneyComb LX2

Arm Servers

Native Armv8 from the desktop to two nodes in 1U.

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HummingBoard · ClearFog · CuBox

Single-Board Computers

Open development kits that carry through to production.

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Flagship platforms

The hardware behind the headline numbers.

AMD Ryzen Embedded 8000

Bedrock R8000

Future-proof edge AI

A sub-1-litre fanless box that stacks Ryzen AI with up to three Hailo accelerators past 100 TOPS.

CPU: 8 cores / 16 threads · to 5.1 GHz
AI: 100+ TOPS · Ryzen AI + Hailo
Memory: 96 GB DDR5 ECC
I/O: USB4 40 Gbps · WiFi 6E · 5G
Environment: −40 to 85 °C · IP40 · fanless
Availability: 10-year guarantee

NXP Layerscape LX2160A

HoneyComb LX2

Arm, natively

A 16-core Armv8 workstation, and a 1U that packs two compute nodes into a single rack unit.

CPU: 16 × Cortex-A72
Memory: Up to 64 GB
Form: Mini-ITX · 1U dual-sled
OS: Linux · BSD · ESXi

Hailo-15 vision SoC

Hailo-15 SOM

AI at a camera's power

Up to 20 TOPS of vision inference on a 47 × 30 mm module sipping around a watt.

NPU: Up to 20 TOPS
Imaging: 4K ISP · 2 × MIPI-CSI2
Memory: 8 GB LPDDR4 · to 256 GB eMMC
Size: 47 × 30 mm · ~1 W

NXP i.MX 8M Plus

i.MX8M Plus SOM

The long-life workhorse

A 2.3-TOPS industrial module with TSN networking and a real-time M7, guaranteed to 2036. From $61.

CPU: 4 × A53 + Cortex-M7
NPU: 2.3 TOPS
Networking: 2 × GbE (1 × TSN)
Longevity: To 2036 · from $61

Let's build it

Let's build the technology to power the future.

Tell us the workload, the environment, and the volume. We will point you at the right building block, or design one.

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