● SolidRun · Embedded systemsN 32°55′ · E 35°04′ · Acre, IL · Rev 2026

From silicon to system · 001 / 06

Driving embedded computing to the edge.

Application-ready compute and networking platforms on open architecture. From System-on-Module to finished system, so you ship sooner and run leaner.

Explore the platforms Talk to engineering

SolidRun HoneyComb board with a Ryzen Embedded compute module and active cooling

HoneyComb · Arm compute, board to 1U100 × 86 mm

ArchitecturesArm · x86

Silicon partners7

Edge AI100+ TOPS

Availabilityto 2036

/ What we make

One architecture, offered as a module, a board, and a complete system.

SolidRun designs energy-efficient embedded platforms for OEMs and integrators. The same silicon ships as a System-on-Module, a single-board computer, or a sealed fanless computer, so a design scales up or down without starting over.

/ 01Open architecture
/ 02Application-ready
/ 03Pin-compatible
/ 04Silicon-agnostic
/ 05Fanless thermal
/ 06Long lifecycle
/ 07Mainline BSP
/ 08Personal touch

i.MX 8M Plus · System-on-Module47 × 30 mm

01Silicon

Seven silicon partners, one mix-and-match catalog.

Arm and x86, chosen per workload. We carry the board support, the thermal design, and a decade of supply so the processor roadmap is never your problem.

NXP: i.MX & Layerscape
AMD: Ryzen Embedded & AI
Marvell: ARMADA & OCTEON
Arm: Cortex-A & Cortex-M IP
Renesas: RZ/G & RZ/V family
Hailo: Vision-AI accelerators
Analog Devices: Precision sensing & power

02The lineup

Platforms for every layer of the edge.

Modules to swap silicon, boards to prototype on, gateways and systems built to deploy. All documented in the open.

/01 · 06

Flagship

Fanless Industrial PCs

Bedrock family

Sealed, passively cooled edge-AI computers built to run where fans cannot.

Spec sheet

/02 · 06

Systems-on-Module

i.MX · RZ · Hailo · Ryzen

Pin-compatible modules that let you swap silicon, not the product.

Spec sheet

/03 · 06

Networking Platforms

Layerscape · OCTEON · SolidWAN

Arm networking from 2 to 16 cores, wired straight to the CPU.

Spec sheet

/04 · 06

Edge Gateways

SolidSense · HummingBoard IIOT

Deployment-ready IoT gateways with mesh, cellular, and vision options.

Spec sheet

/05 · 06

Arm Servers

HoneyComb LX2

Native Armv8 from the desktop to two nodes in 1U.

Spec sheet

/06 · 06

Single-Board Computers

HummingBoard · ClearFog · CuBox

Open development kits that carry through to production.

Spec sheet

ArchitectureArm + x86
Coresto 16 × A72
Edge AI100+ TOPS
Memoryto 96 GB ECC
Operating−40 to 85 °C
Longevityto 2036

03Flagship dossier · Bedrock R8000

A fanless box that stacks past 100 TOPS.

A sub-1-litre fanless box that stacks Ryzen AI with up to three Hailo accelerators past 100 TOPS.

CPU: 8 cores / 16 threads · to 5.1 GHz
AI: 100+ TOPS · Ryzen AI + Hailo
Memory: 96 GB DDR5 ECC
I/O: USB4 40 Gbps · WiFi 6E · 5G
Environment: −40 to 85 °C · IP40 · fanless
Availability: 10-year guarantee

Open the spec sheet

SolidRun Bedrock R8000 fanless edge-AI computer with antennas

Bedrock R8000 · SR-BR-8000 · sub-1 L · IP40

Studio · 2026

04Edge AI · Bedrock R8000

Inference where the work happens, past 100 TOPS.

Physical AI describes what a machine does in the real world. Edge AI describes where it runs. SolidRun builds the hardware that bridges the two: Ryzen AI and Hailo accelerators stacked into a fanless box, deciding in milliseconds with no cloud round-trip.

Safe physical action needs millisecond decisions. The cloud still trains the models; the edge runs them, on-device, even when the link drops.

100+

TOPS · on-device

/01On-device patient monitoring on a Hailo-15 module
/02Onboard drone navigation and obstacle avoidance
/03Multi-sensor robotics fusion with ROS 2 on RZ/V2N

Bedrock R8000 · AMD Ryzen Embedded 8000 with up to three Hailo accelerators

● Built for the field

Engineered to outlast the deployment.

Industrial temperature, sealed fanless enclosures, ECC and TPM, and a published lifecycle. The kind of reliability you only notice when it never fails.

[+] Acre · SMT line 02[+] JESD46 controlled[+] Run #20260507

Request a quoteRFQ · Engineering · Dev Center

05Built for the field

TEMP: −40 / +85; Industrial °C range
LIFE: 2027–2037; Per-SKU longevity window
PCN: JESD46; 90-day change notice
SEAL: IP40; Fanless aluminium enclosure
TRUST: ECC · TPM; ECC memory, secure boot
STOCK: 10 yr; AMD platform availability

06Where it runs

From the factory floor to the 5G core.

The same building blocks adapt across regulated, rugged, and high-throughput environments.

5G & Networking: Base stations, transport, smart NICs, NFV
Industrial Automation: Controllers, HMI, machine vision, robotics
Intelligent Transport: V2X, telematics, roadside edge units
Security & Surveillance: ITS, perimeter, access control, NVR
Healthcare: On-device monitoring, imaging, diagnostics
Retail & POS: Vision checkout, signage, kiosks
Agriculture: Sensing, autonomy, asset tracking
Robotics & AMR: Sensor fusion, ROS 2, navigation

07Engineering services

A one-stop shop, with a personal touch.

Reuse our building blocks, or hand us the whole problem. Every project gets a dedicated manager, and you own the design files at the end.

Planning: A dedicated project manager scopes processing, power, thermal, and OS from day one.
Hardware: Custom carriers, SBCs, fanless systems, and networking platforms around our modules.
Software: Optimised Linux BSPs with long-term support and mainline contributions on GitHub.
Thermal & mechanical: Passive cooling, heat spreaders, and enclosures tuned to the environment.
Compliance & production: Regulatory testing, image flashing, packaging, and traceable functional QC.
Your IP: OEM branding throughout, and you own the full design and production files.