SolidRun at Embedded World 2026 · Booth visits and edge-AI demos

SR / 005About SolidRun

Embedded engineering, with a personal touch.

We design energy-efficient embedded platforms for OEMs and integrators, on open architecture, from a base in Acre, Israel. The goal is simple: make deployment someone else's easy problem.

Acre, IL
Headquarters
7
Silicon partners
Arm · x86
Architectures carried
Open
BSPs, upstreamed

Why SolidRun

Six reasons engineers reach for us.

Mix-and-match building blocks
The same silicon ships as a module, a board, and a system, with pin-compatible modules and reusable carriers.
Application-ready
Board support, drivers, and power handled, so the SoC complexity is ours and the time-to-market is yours.
Open and silicon-agnostic
Arm and x86 across seven silicon partners, with open dev kits and BSPs contributed upstream on GitHub.
Built to last
Published per-SKU longevity into the 2030s, JESD46 change control, and industrial −40 to 85 °C ruggedization.
Edge-AI thermal engineering
Stacked NPUs past 100 TOPS inside fanless enclosures that dissipate over three times the power of their size class.
A personal touch
A one-stop shop with a dedicated project manager, and you own the full design and production files at the end.

Engineering services

Reuse our blocks, or hand us the whole problem.

Planning
A dedicated project manager scopes processing, power, thermal, and OS from day one.
Hardware
Custom carriers, SBCs, fanless systems, and networking platforms around our modules.
Software
Optimised Linux BSPs with long-term support and mainline contributions on GitHub.
Thermal & mechanical
Passive cooling, heat spreaders, and enclosures tuned to the environment.
Compliance & production
Regulatory testing, image flashing, packaging, and traceable functional QC.
Your IP
OEM branding throughout, and you own the full design and production files.

Quality & longevity

A lifecycle published years ahead.

JESD46 and J-STD-048 change control, a 90-day minimum notice on any form-fit-function change, and availability commitments you can design a ten-year product against.

TEMP
−40 / +85
Industrial °C range
LIFE
2027–2037
Per-SKU longevity window
PCN
JESD46
90-day change notice
SEAL
IP40
Fanless aluminium enclosure
TRUST
ECC · TPM
ECC memory, secure boot
STOCK
10 yr
AMD platform availability

Powered by NXP · AMD · Marvell · Arm · Renesas · Hailo · Analog Devices

Let's build it

Let's build the technology to power the future.

Tell us the workload, the environment, and the volume. We will point you at the right building block, or design one.